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NXP IC And Microcrontrollers

Leading Service Provider of lpc2148fbd64,151 nxp microcontroller lpc2141fbd64,151 lpc2148fbd64,157 nxp microcontroller, apq-8009-0-504nsp-tr-01-1-aa qualcomm arm cortex-a7 application processor, quad core, 1.267ghz, lpc2378fbd144 integrated circuits, mc33771btp1ae nxp ic, mc9s12xd256ca nxp semiconductor 6-bit microcontrollers - mcu 9s12xd256 and mcimx253cjm4a nxp semiconductor microprocessors - mpu i.mx25 applications processor from New Delhi.

LPC2148FBD64,151 Nxp Microcontroller LPC2141FBD64,151 LPC2148FBD64,157 Nxp Microcontroller

LPC2148FBD64,151 Nxp Microcontroller  LPC2141FBD64,151  LPC2148FBD64,157  Nxp  Microcontroller
  • LPC2148FBD64,151 Nxp Microcontroller  LPC2141FBD64,151  LPC2148FBD64,157  Nxp  Microcontroller
  • LPC2148FBD64,151 Nxp Microcontroller  LPC2141FBD64,151  LPC2148FBD64,157  Nxp  Microcontroller
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Approx. Price: Rs 1,500 / PieceGet Latest Price

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Part NumberLPC2148FBD64,151
Mounting TypeSMD/SMT
BrandNXP SEMICONDUCTORS
Device CoreARM7TDMI-S
RAM Size32 kB
ADC Resolution2 x 10 bit
Package TypeLQFP-64

The LPC2141/42/44/46/48 microcontrollers are based on a 16-bit/32-bit ARM7TDMI-S CPU with real-time emulation and embedded trace support, that combine the microcontroller with embedded high-speed flash memory ranging from 32 kB to 512 kB. A 128-bit wide memory interface and a unique accelerator architecture enable 32-bit code execution at the maximum clock rate. For critical code size applications, the alternative 16-bit Thumb mode reduces code by more than 30 % with minimal performance penalty. Due to their tiny size and low power consumption, LPC2141/42/44/46/48 are ideal for applications where miniaturization is a key requirement, such as access control and point-of-sale. Serial communications interfaces ranging from a USB 2.0 Full-speed device, multiple UARTs, SPI, SSP to I2C-bus and on-chip SRAM of 8 kB up to 40 kB, make these devices very well suited for communication gateways and protocol converters, soft modems, voice recognition and low end imaging, providing both large buffer size and high processing power. Various 32-bit timers, single or dual 10-bit ADC(s), 10-bit DAC, PWM channels and 45 fast GPIO lines with up to nine edge or level sensitive external interrupt pins make these microcontrollers suitable for industrial control and medical systems. 2. Features and benefits
Product AttributeAttribute ValueSearch Similar
Manufacturer:NXP
Product Category:ARM Microcontrollers - MCU
RoHS: Details
Mounting Style:SMD/SMT
Package/Case:LQFP-64
Core:ARM7TDMI-S
Program Memory Size:512 kB
Data Bus Width:32 bit/16 bit
ADC Resolution:2 x 10 bit
Maximum Clock Frequency:25 MHz
Number of I/Os:45 I/O
Data RAM Size:32 kB
Supply Voltage - Min:3.3 V
Supply Voltage - Max:3.3 V
Minimum Operating Temperature:- 40 C
Maximum Operating Temperature:+ 85 C
Packaging:Tray
Brand:NXP Semiconductors
Operating Supply Voltage:3.3 V
Product Type:ARM Microcontrollers - MCU
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APQ-8009-0-504NSP-TR-01-1-AA Qualcomm Arm Cortex-A7 Application Processor, Quad Core, 1.267ghz

APQ-8009-0-504NSP-TR-01-1-AA Qualcomm  Arm Cortex-A7 Application Processor, Quad Core, 1.267ghz
  • APQ-8009-0-504NSP-TR-01-1-AA Qualcomm  Arm Cortex-A7 Application Processor, Quad Core, 1.267ghz
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Approx. Price: Rs 990 / PIECEGet Latest Price

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Part NumberAPQ-8009-0-504NSP-TR-01-1-AA
Dimensions14*14
Mounting TypeSurface Mount
Pin Count48
BrandQUALCOMM ATHEROS, INC
Device CoreQuad Core
RAM Size1.267GHz
Package TypeQFN-64

e can supply APQ-8009-0-504NSP-TR-01-1-AA , send us a request quote to request APQ-8009-0-504NSP-TR-01-1-AA pirce and lead time. a professional electronic components distributor. With 10+ Million line items of available electronic components can ship in short lead-time, over 250 thousand part numbers of electronic components in stock for immediately delivery, which may include part number APQ-8009-0-504NSP-TR-01-1-AA.The price and lead time for APQ-8009-0-504NSP-TR-01-1-AA depending on the quantity required, availability and warehouse location.Contact us today and our sales representative will provide you price and delivery on Part APQ-8009-0-504NSP-TR-01-1-AA.We look forward to working with you to establish long-term relations of cooperation
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LPC2378FBD144 Integrated Circuits

LPC2378FBD144 Integrated Circuits
  • LPC2378FBD144 Integrated Circuits
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Approx. Price: Rs 1,200 / PieceGet Latest Price

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BrandNXP
Usage/ApplicationElectronics
Mounting TypeSMD
Part NumberLPC2378FBD144,551
Package TypeBox
TypeNon-Leaded
PackageLQFP144
Maximum Operating Temperature85 Deg C

ARM Microcontrollers - MCU ARM7 with 512KB flash, 58 KB SRAM, Ethernet, USB 2.0 Device, CAN, and 10-bit ADC.
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MC33771BTP1AE NXP IC

MC33771BTP1AE NXP IC
  • MC33771BTP1AE NXP IC
  • MC33771BTP1AE NXP IC
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Approx. Price: Rs 120 / PieceGet Latest Price

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Minimum Order Quantity100 Piece
BrandNXP
Usage/ApplicationElectronics
Mounting TypeSMD
Part NumberMC33771BTP1AE
Package TypeBox
CertificationEU
PackageQFP-64
Current20 A
Temperature85 Deg C
Voltage220 V
Number Of Pins64 Pins
Weight0.34 gm
Power230
IC Pin64
Isolation Voltage80 V
MaterialSilicone

The 33771 is a SMARTMOS lithium-ion battery cell controller IC designed for automotive applications, such as hybrid electric (HEV) and electric vehicles (EV) along with industrial applications, such as energy storage systems (ESS) and uninterruptible power supply (UPS) systems. The device performs ADC conversions of the differential cell voltages and current, as well as battery coulomb counting and battery temperature measurements. The information is digitally transmitted through the Serial Peripheral Interface (SPI) or Transformer Isolation (TPL) to a microcontroller for processing. 

Features:
  • 9.6 V ≤ VPWR ≤ 61.6 V operation, 75 V transient 
  • 7 to 14 cells management 
  • Isolated 2.0 Mbps differential communication or 4.0 Mbps SPI 
  • Addressable on initialization 
  • 0.8 mV maximum total voltage measurement error 
  • Synchronized cell voltage/current measurement with coulomb count 
  • Total stack voltage measurement 
  • Seven GPIO/temperature sensor inputs 
  • 5.0 V at 5.0 mA reference supply output 
  • Automatic over/undervoltage and temperature detection routable to fault pin 
  • Integrated sleep mode over/undervoltage and temperature monitoring 
  • Onboard 300 mA passive cell balancing with diagnostics 
  • Hot plug capable
  • Detection of internal and external faults, as open lines, shorts, and leakages 
  • Designed to support ISO 26262, up to ASIL D safety system 
  • Fully compatible with the MC33772 for a maximum of six cells 
  • Qualified in compliance with AEC–Q100
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MC9S12XD256CA NXP Semiconductor 6-Bit Microcontrollers - MCU 9S12XD256

MC9S12XD256CA NXP Semiconductor 6-Bit Microcontrollers - MCU 9S12XD256
  • MC9S12XD256CA NXP Semiconductor 6-Bit Microcontrollers - MCU 9S12XD256
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Approx. Price: Rs 1,050 / PieceGet Latest Price

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Part NumberMC9S12XD256CA
Mounting TypeSMD/SMT
Pin Count80 Pins
BrandNXP
Device CoreHCS12X
Package TypePQFP-80

Section Number Chapter 1 Chapter 2 Chapter 3 Chapter 4 Title Device Overview MC9S12XD-Family . . . . . . . . . . . . . . . . . . . .31 Clocks and Reset Generator (S12CRGV6). . . . . . . . . . . . . . . .79 Pierce Oscillator (S12XOSCLCPV1) . . . . . . . . . . . . . . . . . . . .119 Analog-to-Digital Converter (ATD10B16CV4) Block Description125 Chapter 5 Analog-to-Digital Converter (S12ATD10B8CV3) . . . . . . . . . .159 Chapter 6 Chapter 7 Chapter 8 Chapter 9 XGATE (S12XGATEV2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .183 Enhanced Capture Timer (S12ECT16B8CV2) . . . . . . . . . . . .309 Pulse-Width Modulator (S12PWM8B8CV1) . . . . . . . . . . . . . .363 Inter-Integrated Circuit (IICV2) Block Description. . . . . . . . .395 Chapter 10 Freescale’s Scalable Controller Area Network (S12MSCANV3). 419 Chapter 11 Serial Communication Interface (S12SCIV5) . . . . . . . . . . . . .477 Chapter 12 Serial Peripheral Interface (S12SPIV4). . . . . . . . . . . . . . . . . .515 Chapter 13 Periodic Interrupt Timer (S12PIT24B4CV1) . . . . . . . . . . . . . .541 Chapter 14 Voltage Regulator (S12VREG3V3V5) . . . . . . . . . . . . . . . . . . .555 Chapter 15 Background Debug Module (S12XBDMV2) . . . . . . . . . . . . . .569 Chapter 16 Interrupt (S12XINTV1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .595 Chapter 17 Memory Mapping Control (S12XMMCV2). . . . . . . . . . . . . . . .613 Chapter 18 Memory Mapping Control (S12XMMCV3) . . . . . . . . . . . . . . .651 Chapter 19 S12X Debug (S12XDBGV2) Module . . . . . . . . . . . . . . . . . . . .693 Chapter 20 S12X Debug (S12XDBGV3) Module . . . . . . . . . . . . . . . . . . . .745 Chapter 21 External Bus Interface (S12XEBIV2) . . . . . . . . . . . . . . . . . . .787 Chapter 22 DP512 Port Integration Module (S12XDP512PIMV2). . . . . . .807 Chapter 23 DQ256 Port Integration Module (S12XDQ256PIMV2) . . . . . .901 Chapter 24 DG128 Port Integration Module (S12XDG128PIMV2) . . . . . .975
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Mcimx253cjm4a NXP Semiconductor Microprocessors - Mpu I.Mx25 Applications Processor

Mcimx253cjm4a  NXP Semiconductor  Microprocessors - Mpu I.Mx25 Applications Processor
  • Mcimx253cjm4a  NXP Semiconductor  Microprocessors - Mpu I.Mx25 Applications Processor
  • Mcimx253cjm4a  NXP Semiconductor  Microprocessors - Mpu I.Mx25 Applications Processor
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Approx. Price: Rs 800 / PieceGet Latest Price

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BrandNXP SEMICONDUCTOR
Part NumberMCIMX253CJM4A
COREARM926EJ-S
Number of Cores:1 CORE
Data Bus Width:32BIT
Package/Case:MAPBGA-400

i.MX25 Applications Processor for Consumer and Industrial Products Silicon Version 1.2The i.MX25 multimedia applications processor has the right mix of high performance, low power, and integration to support the growing needs of the industrial and general embedded markets. At the core of the i.MX25 is Freescale's fast, proven, power-efficient implementation of the ARM® 926EJ-S™ core, with speeds of up to 400MHz. The i.MX25 includes support for up to 133 MHz DDR2 memory, integrated 10/100 Ethernet MAC, and two on-chip USB PHYs. The device is suitable for a wide range of applications, including the following: •Graphical remote controls •Human Machine Interface (HMI) •Residential and commercial control panels •Residential gateway (smart metering) •Handheld scanners and printers •Electronic point-of-sale terminals •Patient-monitoring devicesDescriptionPart NumberSilicon Version Projected Temperature Range (°C) PackageBallmap i.MX253MCIMX253DVM41.1–20 to +7017 x 17 mm, 0.8 mm pitch, MAPBGA-400 Table103 i.MX257MCIMX257DVM41.1–20 to +7017 x 17 mm, 0.8 mm pitch, MAPBGA-400 Table103 i.MX253MCIMX253CVM41.1–40 to +8517 x 17 mm, 0.8 mm pitch, MAPBGA-400 Table103 i.MX257MCIMX257CVM41.1–40 to +8517 x 17 mm, 0.8 mm pitch, MAPBGA-400 Table103 i.MX258MCIMX258CVM41.1–40 to +8517 x 17 mm, 0.8 mm pitch, MAPBGA-400 Table103 i.MX253MCIMX253DJM41.1–20 to +7017 x 17 mm, 0.8 mm pitch, MAPBGA-400 Table103 i.MX257MCIMX257DJM41.1–20 to +7017 x 17 mm, 0.8 mm pitch, MAPBGA-400 Table103 i.MX253MCIMX253CJM41.1–40 to +8517 x 17 mm, 0.8 mm pitch, MAPBGA-400 Table103 i.MX257MCIMX257CJM41.1–40 to +8517 x 17 mm, 0.8 mm pitch, MAPBGA-400 Table103 i.MX258MCIMX258CJM41.1–40 to +8517 x 17 mm, 0.8 mm pitch, MAPBGA-400 Table103 i.MX253MCIMX253DJM4A1.2–20 to +7017 x 17 mm, 0.8 mm pitch, MAPBGA-400 Table103 i.MX257MCIMX257DJM4A1.2–20 to +7017 x 17 mm, 0.8 mm pitch, MAPBGA-400 Table103 i.MX257MCIMX257DJM4AR21.2–20 to +7017 x 17 mm, 0.8 mm pitch, MAPBGA-400 Table103 i.MX253MCIMX253CJM4A1.2–40 to +8517 x 17 mm, 0.8 mm pitch, MAPBGA-400 Table103 i.MX257MCIMX257CJM4A1.2–40 to +8517 x 17 mm, 0.8 mm pitch, MAPBGA-400 Table103 i.MX258MCIMX258CJM4A1.2–40 to +8517 x 17 mm, 0.8 mm pitch, MAPBGA-400 Table103 i.MX257MCIMX257CJN4A1.2–40 to +8512 x 12mm, 0.5mm pitch, MAPBGA-347 Table107i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 10 4Freescale Semiconductor Table2 shows the functional differences between the different parts in the i.MX25 family. Table2. i.MX25 Parts Functional Differences FeaturesMCIMX253MCIMX257MCIMX258 CoreARM 926EJ-S ARM 926EJ-SARM 926EJ-S CPU Speed 400 MHz400 MHz400 MHz L1 I/D Cache16K I/D 16K I/D16K I/D On-chip SRAM 128 KB128 KB128 KB PATA/CE-ATAYesYesYes LCD ControllerYesYesYes Touchscreen—YesYes CSI—YesYes FlexCAN (2)—YesYes ESAI—YesYes SIM (2)—YesYes Security ——Yes 10/100 Ethernet YesYesYes HS USB 2.0 OTG + PHYYesYesYes HS USB 2.0 Host + PHYYesYesYes
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PCA82C251T/YM,118 Nxp Semiconductors

PCA82C251T/YM,118 Nxp Semiconductors
  • PCA82C251T/YM,118 Nxp Semiconductors
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Approx. Price: Rs 250 / PieceGet Latest Price

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Mounting TypeDIP
BrandNXP
Electrode MaterialAluminum
Model Name/NumberPCA82C251T/YM
DopingLess Dopped
Voltage230 V
Current20 mA
Frequency50 Hz
Packaging TypeBox

Details:
  • NXP Semiconductors NXP Semiconductors PCA82C251T/SO8//YM/REEL 13 Q1/T1 STANDARD MARK S
  • NXP Semiconductors PCA82C251T/SO8//YM/REEL 13 Q1/T1 STANDARD MARK S
  • NXP Semiconductors PCA82C251T/SO8//YM/REEL 13 Q1/T1 STANDARD MARK S
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NXP FS32K144HAT0VLLT Microcontroller

NXP FS32K144HAT0VLLT Microcontroller
  • NXP FS32K144HAT0VLLT Microcontroller
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Part NumberFS32K144HAT0VLLT
Mounting TypeSMD/SMT
Pin Count100 Pins
BrandNXP
Device CoreARM Cortex M4F
RAM Size64 kB
ADC Resolution12 Bits
Package TypeLQFP-100
Voltage2.7 V to 5.5 V
Ambient Temperature Range-40 DegreeC to 105 DegreeC for HSRUN mode, -40 DegreeC to 150 DegreeC for RUN mode

Details:
  • ARM Microcontrollers - MCU S32K144 32-bit MCU, ARM Cortex-M4F
  • Arm Cortex-M4F/M0+ core, 32-bit CPU 
  • Supports up to 112 MHz frequency (HSRUN mode) with 1.25 Dhrystone MIPS per MHz 
  • Arm Core based on the Armv7 Architecture and Thumb®-2 ISA 
  • Integrated Digital Signal Processor (DSP) 
  • Configurable Nested Vectored Interrupt Controller (NVIC) 
  • Single Precision Floating Point Unit (FPU)
  • Clock interfaces – 4 - 40 MHz fast external oscillator (SOSC) with up to 50 MHz DC external square input clock in external clock mode – 48 MHz Fast Internal RC oscillator (FIRC) – 8 MHz Slow Internal RC oscillator (SIRC) – 128 kHz Low Power Oscillator (LPO) – Up to 112 MHz (HSRUN) System Phased Lock Loop (SPLL) – Up to 20 MHz TCLK and 25 MHz SWD_CLK – 32 kHz Real Time Counter external clock.
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LPC1788FBD208,551 NXP Microcrontroller

LPC1788FBD208,551 NXP Microcrontroller
  • LPC1788FBD208,551 NXP Microcrontroller
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Part NumberLPC1788FBD208,551
Mounting TypeSurface Mount
Pin Count208 Pins
BrandNXP
Device CoreARM CorteX M3
RAM Size96K x 8
Package Type208-LQFP
Maximum Operating Temperature85 Deg C

LPC178x/7x 32-bit ARM Cortex-M3 microcontroller; up to 512 kB flash and 96 kB SRAM; USB Device/Host/OTG; Ethernet; LCD; EMCThe LPC178x/7x is an ARM Cortex-M3 based microcontroller for embedded applications requiring a high level of integration and low power dissipation. The ARM Cortex-M3 is a next generation core that offers better performance than the ARM7 at the same clock rate and other system enhancements such as modernized debug features and a higher level of support block integration. The ARM Cortex-M3 CPU incorporates a 3-stage pipeline and has a Harvard architecture with separate local instruction and data buses, as well as a third bus with slightly lower performance for peripherals. The ARM Cortex-M3 CPU also includes an internal prefetch unit that supports speculative branches. The LPC178x/7x adds a specialized flash memory accelerator to accomplish optimal performance when executing code from flash. The LPC178x/7x operates at up to 120 MHz CPU frequency. The peripheral complement of the LPC178x/7x includes up to 512 kB of flash program memory, up to 96 kB of SRAM data memory, up to 4032 byte of EEPROM data memory, External Memory Controller (EMC), LCD (LPC178x only), Ethernet, USB Device/Host/OTG, a General Purpose DMA controller, five UARTs, three SSP controllers, three I2C-bus interfaces, a Quadrature Encoder Interface, four general purpose timers, two general purpose PWMs with six outputs each and one motor control PWM, an ultra-low power RTC with separate battery supply and event recorder, a windowed watchdog timer, a CRC calculation engine, up to 165 general purpose I/O pins, and more. The analog peripherals include one eight-channel 12-bit ADC and a 10-bit DAC. The pinout of LPC178x/7x is intended to allow pin function compatibility with the LPC24xx and LPC23xx. For additional documentation, see Section 18 “ References ” . 2. Features and benefits  Functional replacement for the LPC23xx and LPC24xx family devices.  System: ARM Cortex-M3 processor, running at frequencies of up to 120 MHz. A Memory Protection Unit (MPU) supporting eight regions is included. ARM Cortex-M3 built-in Nested Vectored Interrupt Controller (NVIC).LPC178x/7x NXP Semiconductors 32-bit ARM Cortex-M3 microcontroller Multilayer AHB matrix interconnect provides a separate bus for each AHB master. AHB masters include the CPU, USB, Ethernet, and the General Purpose DMA controller. This interconnect provides communication with no arbitration delays unless two masters attempt to access the same slave at the same time. Split APB bus allows for higher throughput with fewer stalls between the CPU and DMA. A single level of write buffering allows the CPU to continue without waiting for completion of APB writes if the APB was not already busy. Cortex-M3 system tick timer, including an external clock input option. Standard JTAG test/debug interface as well as Serial Wire Debug and Serial WireTrace Port options. Embedded Trace Macrocell (ETM) module supports real-time trace. Boundary scan for simplified board testing. Non-maskable Interrupt (NMI) input.  Memory: Up to 512 kB on-chip flash program memory with In-System Programming (ISP) and In-Application Programming (IAP) capabilities. The combination of an enhanced flash memory accelerator and location of the flash memory on the CPU local code/data bus provides high code performance from flash. Up to 96 kB on-chip SRAM includes: 64 kB of main SRAM on the CPU with local code/data bus for high-performance CPU access. Two 16 kB peripheral SRAM blocks with separate access paths for higher throughput. These SRAM blocks may be used for DMA memory as well as for general purpose instruction and data storage. Up to 4032 byte on-chip EEPROM.  LCD controller, supporting both Super-Twisted Nematic (STN) and Thin-Film Transistors
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LPC1754FBD80,551 NXP Microcontroller

LPC1754FBD80,551 NXP Microcontroller
  • LPC1754FBD80,551 NXP Microcontroller
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BrandNXP
Usage/ApplicationElectronics
Mounting TypeSMD
Part NumberLPC1754FBD80,551
Package TypeBox
TypeLeaded
PackageLQFP-80
Current20 A
Temperature85 Deg C
Voltage40 VDC

ARM Microcontrollers - MCU CORTEX-M3 128 KB FL 32 KB SRAM USB 2.0The LPC1759/58/56/54/52/51 are ARM Cortex-M3 based microcontrollers for embedded applications featuring a high level of integration and low power consumption. The ARM Cortex-M3 is a next generation core that offers system enhancements such as enhanced debug features and a higher level of support block integration. The LPC1758/56/57/54/52/51 operate at CPU frequencies of up to 100 MHz. The LPC1759 operates at CPU frequencies of up to 120 MHz. The ARM Cortex-M3 CPU incorporates a 3-stage pipeline and uses a Harvard architecture with separate local instruction and data buses as well as a third bus for peripherals. The ARM Cortex-M3 CPU also includes an internal prefetch unit that supports speculative branching.
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LPC4357FET256 NXP Microcontroller

LPC4357FET256  NXP Microcontroller
  • LPC4357FET256  NXP Microcontroller
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Part NumberLPC4357FET256
Dimensions17 x 17 cm
Mounting TypeSurface Mount
Pin Count256 Pins
BrandNXP
Device Core32-Bit Dual-Core 204MHz
RAM Size1 MB
ADC Resolution12 bit
Package Type256-LBGA
Maximum Operating Temperature85 Deg C

The LPC435X_3X_2X_1X are ARM Cortex-M4 based microcontrollers with Floating Point Unit (FPU) for embedded applications which include an ARM Cortex-M0 coprocessor, up to 1 MB of flash and 136 kB of on-chip SRAM, 16 kB of EEPROM memory, two high-speed USB controllers, Ethernet, LCD, an external memory controller, a quad SPI Flash Interface (SPIFI) that supports execute-in-place, advanced configurable peripherals such as the State Configurable Timer (SCTimer/PWM) and the Serial General Purpose I/O (SGPIO) interface, and multiple digital and analog peripherals. The LPC435X_3X_2X_1X operate at CPU frequencies of up to 204 MHz. The ARM Cortex-M4 is a 32-bit core that offers system enhancements such as low power consumption, enhanced debug features, and a high level of support block integration. The ARM Cortex-M4 CPU incorporates a 3-stage pipeline, uses a Harvard architecture with separate local instruction and data buses as well as a third bus for peripherals, and includes an internal prefetch unit that supports speculative branching. The ARM Cortex-M4 supports single-cycle digital signal processing and SIMD instructions. A hardware floating-point processor is integrated into the core. The ARM Cortex-M0 coprocessor is an energy-efficient and easy-to-use 32-bit core, which is upward code- and tool-compatible with the Cortex-M4 core. It is ideal for handling control or peripheral handling to free up the Cortex-M4 for real-time processing. The Cortex-M0 coprocessor offers up to 204 MHz performance with a simple instruction set and reduced code size. In LPC43xx, the Cortex-M0 coprocessor hardware multiply is implemented as a 32-cycle iterative multiplier. For additional documentation related to the LPC43xx parts, see 2. Features and benefits Section 17. ??? Cortex-M4 Processor core???ARM Cortex-M4 processor (version r0p1), running at frequencies of up to 204 MHz. ???Built-in Memory Protection Unit (MPU) supporting eight regions. ???Built-in Nested Vectored Interrupt Controller (NVIC). ???Hardware floating-point unit. ???Non-maskable Interrupt (NMI) input. ???JTAG and Serial Wire Debug (SWD), serial trace, eight breakpoints, and four watch points. ???Enhanced Trace Module (ETM) and Enhanced Trace Buffer (ETB) support. ???System tick timer. LPC4357FET256,551  LPC4333FET256,551  LPC4353FET256,551  LPC4337FET256,551  LPC4337JBD144E LPC4357JBD208E  LPC4357JET256,551  LPC4327JBD144E  LPC4333JET256,551  LPC4313JBD144E LPC4322JBD144E  LPC4313JET100E  LPC4333JET100E  LPC4323JBD144E  LPC4325JBD144E  LPC4322JET100E LPC4312JET100E  LPC4333JBD144E  LPC4353JET256,551  LPC4325JET100E  LPC4317JET100E LPC4315JBD144E  LPC4353JBD208E  LPC4315JET100E  LPC4312JBD144E  LPC4337JET256,551 LPC4327JET100E  LPC4323JET100E  LPC4337JET100E  LPC4317JBD144E  LPC4337JET256Y  OM13040,598
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LPC1768FBD100K NXP Microcontroller

LPC1768FBD100K      NXP  Microcontroller
  • LPC1768FBD100K      NXP  Microcontroller
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BrandNXP
Usage/ApplicationElectronics
Mounting TypeSMD
Part NumberLPC1768FBD100K
TypeNon-Leaded
PackageLQFP100

LPC1769/68/67/66/65/64/63 32-bit Arm Cortex®-M3 microcontroller; up to 512 kB flash and 64 kB SRAM with Ethernet, USB 2.0 Host/Device/OTG, CAN
The LPC1769/68/67/66/65/64/63 are ARM Cortex-M3 based microcontrollers for embedded applications featuring a high level of integration and low power consumption. The Arm Cortex-M3 is a next generation core that offers system enhancements such as enhanced debug features and a higher level of support block integration. The LPC1768/67/66/65/64/63 operate at CPU frequencies of up to 100 MHz. The LPC1769 operates at CPU frequencies of up to 120 MHz. The Arm Cortex-M3 CPU incorporates a 3-stage pipeline and uses a Harvard architecture with separate local instruction and data buses as well as a third bus for peripherals. The Arm Cortex-M3 CPU also includes an internal prefetch unit that supports speculative branching. The peripheral complement of the LPC1769/68/67/66/65/64/63 includes up to 512 kB of flash memory, up to 64 kB of data memory, Ethernet MAC, USB Device/Host/OTG interface, 8-channel general purpose DMA controller, 4 UARTs, 2 CAN channels, 2 SSP controllers, SPI interface, 3 I2C-bus interfaces, 2-input plus 2-output I2S-bus interface, 8-channel 12-bit ADC, 10-bit DAC, motor control PWM, Quadrature Encoder interface, four general purpose timers, 6-output general purpose PWM, ultra-low power Real-Time Clock (RTC) with separate battery supply, and up to 70 general purpose I/O pins. The LPC1769/68/67/66/65/64/63 are pin-compatible to the 100-pin LPC236x Arm7-based microcontroller series. For additional documentation, see 2. Features and benefits Section 19 “References”.  Arm Cortex-M3 processor, running at frequencies of up to 100 MHz (LPC1768/67/66/65/64/63) or of up to 120 MHz (LPC1769). A Memory Protection Unit (MPU) supporting eight regions is included.  Arm Cortex-M3 built-in Nested Vectored Interrupt Controller (NVIC).  Up to 512 kB on-chip flash programming memory. Enhanced flash memory accelerator enables high-speed 120 MHz operation with zero wait states.  In-System Programming (ISP) and In-Application Programming (IAP) via on-chip bootloader software.   On-chip SRAM includes:  32/16 kB of SRAM on the CPU with local code/data bus for high-performance CPU access.NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller  Two/one 16 kB SRAM blocks with separate access paths for higher throughput. These SRAM blocks may be used for Ethernet, USB, and DMA memory, as well as for general purpose CPU instruction and data storage.  Eight channel General Purpose DMA controller (GPDMA) on the AHB multilayer matrix that can be used with SSP, I2S-bus, UART, Analog-to-Digital and Digital-to-Analog converter peripherals, timer match signals, and for memory-to-memory transfers.  Multilayer AHB matrix interconnect provides a separate bus for each AHB master. AHB masters include the CPU, General Purpose DMA controller, Ethernet MAC, and the USB interface. This interconnect provides communication with no arbitration delays. ??? Split APB bus allows high throughput with few stalls between the CPU and DMA.
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