LV237x-Q1 550-µA/Channel, 3-MHz Rail-to-Rail Input and Output Operational Amplifiers 1 Features 1 • Qualified for Automotive Applications • AEC-Q100 Qualified With the Following Results:– Device Temperature Grade 1:–40°C to 125°C Ambient Operating Temperature Range– Device HBM ESD Classification Level 2– Device CDM ESD Classification Level C4B • Rail-to-Rail Input and Output • WideBandwidth: 3 MHz • High Slew Rate: 2.4 V/µs • Supply Voltage Range: 2.7 V to 16 V • Supply Current: 550 µA/Channel • Input Noise Voltage: 39 nV/√Hz • Input Bias Current: 1 pA • Ultra-Small Packaging:– 5-Pin SOT-23 (TLV2371-Q1) 2 Applications • Engine Control Units (ECU) • BodyControl Modules (BCM) • Battery Management Systems • HEV/EV Inverters • Lane Departure Warning • White Goods 1 3 Description The TLV237x-Q1 devices are single-supply operational amplifiers providing rail-to-rail input and output capability. The TLV237x-Q1 takes the minimum operating supply voltage down to 2.7 V and up to 16 V over the extended automotive temperature range. Therefore, the wide voltage range can support both start-stop functionality and a connection directly to the typical 12-V battery. The rail-to-rail capabilities allow the device to maximize the output signal and avoid clipping. 12 11 10 Output Voltage in Volts 9 8 7 6 5 4 3 2 1 0 The CMOS inputs enable high-impedance suitable for engine control units (ECU), body control modules (BCM), battery management systems (BMS), and HEV/EV inverters. This also allows the user to draw a lower offset voltage and maintain low power consumption to help meet overall system needs for quiescent current such as in infotainment or cluster, HEV/EV, and powertrain. Additionally, the TLV237x-Q1 family supports a high common-mode rail to the supply voltage. This feature sets no gain limitations and can support the input at any level without the concern for any phase reversal. Device Information(1) PART NUMBER PACKAGE SOT-23 (5) TLV2371-Q1 TLV2372-Q1 TLV2374-Q1 SOIC (8) BODY SIZE (NOM) 2.90 mm × 1.60 mm 4.90 mm × 3.91 mm SOIC (8) SOIC (14) TSSOP (14) 4.90 mm × 3.91 mm 8.65 mm × 3.91 mm 5.00 mm × 4.40 mm (1) For all available packages, see the orderable addendum at the end of the data sheet.